The Adhesives and Sealants Council (ASC) has announced a call
for papers for its spring 2005 convention and exposition that
will take place April 17-20 in Columbus, Ohio. The abstract submission
deadline is January 28, 2005.
Some topics that may be covered include next generation silicones,
new caulk and sealant formulations, hot melt chemistries, environmentally
preferred products (i.e. Green building initiatives) and how changing
substrates demand new adhesive formulations.
To learn more about the conference visit www.asccouncil.org