The Adhesives and Sealants Council (ASC) has announced a call for papers for its spring 2005 convention and exposition that will take place April 17-20 in Columbus, Ohio. The abstract submission deadline is January 28, 2005.

Some topics that may be covered include next generation silicones, new caulk and sealant formulations, hot melt chemistries, environmentally preferred products (i.e. Green building initiatives) and how changing substrates demand new adhesive formulations.

To learn more about the conference visit www.asccouncil.org